A new 3D glass printing process developed at Karlsruhe Institute of Technology (KIT), Germany, produces nanometer-fine quartz glass structures that can be printed directly onto semiconductor chips. A ...
FRIEDBERG, Germany--(BUSINESS WIRE)--voxeljet AG (NYSE: VJET) (the “Company”, or “voxeljet”), a leading provider of high-speed, large-format 3D printers and on-demand parts services to industrial and ...
ZnO varistor ceramics were synthesised by cold sintering/spark plasma sintering and post-annealing treatment. Intriguingly, the ZnO varistor ceramics present ultrahigh potential gradient, high ...
Founded in 1987, Boschman Technologies B.V. is a manufacturer of sintering equipment and transfer molding technology for advanced packaging of automotive and industrial power modules, MEMS sensors. In ...
Microwave cold sintering process (MW-CSP) was used to densify NaCl, KDP, MgMoO₄, Li₂MoO₄, and TiO₂ ceramics. Under the fundamental densification mechanisms dominated by the coupling of the transient ...
Sintering process simulation software corrects for shrinkage and distortion of binder jet 3D printed parts during sintering, minimizing trial and error Live Sinter ...
Tolerating heat and helping to reduce it are both attributes that sintering offers as an alternative to soldering in power electronics applications. Doing more with less and, of course, packing more ...
Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...
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