The shift to multi-die assemblies is forcing changes in how chips are tested and inspected in order to achieve sufficient yield ramp or respond more quickly to yield excursions.

THE authors of the work under notice commence with a summary of the objects of inspection, and follow this by descriptions of inspection methods ranging from the inspection of raw materials to the ...

For decades, optical inspection has been the primary method for process control in fabs. However, the move to multi-level ...

India’s vast network of overhead power lines presents a persistent challenge for inspection and maintenance, with current methods proving either unsafe or prohibitively expensive. Two undergraduate ...