Abstract: A fast and convenient method to 3D print and metalize circular waveguide components is demonstrated using polylactic acid (PLA) and aluminum adhesive backed tape. A gradient index (GRIN) ...
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Abstract: We report on the development of a "dry" lasersingulation process for Si-wafers with back side metallization targeting small die sizes below 0.07 mm2. The dicing technology aims at improved ...
600486.SS Jiangsu Yangnong Chemical Co., Ltd.
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